_ THE ROLE: In this role you will lead the development of next generation packaging for high speed signaling. THE PERSON... independently. RESPONSIBILITIES : Lead development of power delivery-related packaging technologies including next-generation...
solutions for high power products; high speed signaling interfaces such as PCIe Gen4/Gen5; PCB technology, layout, and stack-ups... and Power team, we design high-technology platforms for world-class products based on AMD’s Graphics Processing Units (GPU...